Design of compact 4×4 X-band Butler with lump element based on IPD technology

A X-band 4×4 Butler Matrix in IPD (Integrated Passive Device) technology is presented. Coupler and the phase shifter constituted by lumped circuits are utilized for Butler miniaturization. The compact chip area of implemented IPD Butler only occupies 2.12×2.07 mm
²
including all test pads. The result show the isolation of >12dB, the average loss of 3dB and the phase errors are within 5° at 9.5-10.5GHz.