New technonomics trends and concepts of manufacturing for competitive deep-submicron ULSI and WSI

Technology and economics trends and concepts of advanced semiconductor manufacturing are considered. While DRAM and CMOS technologies are the work horses of modern VLSL in many application, the cost of dramatic process changes may not be justified by the benefits. Breakthrough bipolar-CMOS technologies, circuits and architectures offer potential advantages over simple scaling of CMOS. The key to a successful strategy of competitive deep-submicron ULSI, 2D-, 3D-WSI fabrication as complete systems is flexibility and performance. Research effort and breakthroughs are needed to explore more competitive developments for ULSI, 2D-, 3D-WSI manufacturing on Earth and in Space. Linking between flexible megafabs, pilot minifabs and Spacefabs will have to be planned for improved performance and reduced cycle time and cost of competitive advanced products.