Novel shielding structure for LTE and 3G RF design

This paper describes a novel method of shielding for multiple compartments. A molding, scribing, and coating process is used to create the shielding structure that is flexible, high performance, and low cost. Simulation is used to analyze and predict the shielding effect for various coating material, thickness, and over frequency. This simulation is verified by experiment. Moreover, a HSPA modem is implemented using this shielding structure. The result shows that this modem has excellent RF performance, and meets all 3GPP RF requirements.