The 300mm Technology Current Status And Future Prospect

Development of the 300mm technology is approaching the exciting part of the program. The transition in the wafer diameter fiom 200mm to 300mm is expected to result in the chip cost reduction by the range of 1.520% and to decrease the investment in the production line down to about 65%. The technological key issues would be the crystal growth and the heat treatment. World-wide cooperative efforts are being made for the evaluation of the equipment and materials and for the standardiition.