Qualification of surface mount technologies for random vibration in environmental stress screens

High density surface mount technologies such as ball grid array and column grid array are less robust with respect to random vibration stress than leaded surface mount devices. Intermittent failures can occur under vibration stress that are not detectable when the stress is removed. The devices are more vulnerable to vibration stresses at high temperature (80/spl deg/C) than at low (-30/spl deg/C). Guidelines for optimized vibration levels in environmental stress screens can be determined from damage data obtained using Miner's rule.