Inductive coupling transceivers for inter-chip data communication

ThruChip Interface (TCI) employing inductive coupling bares comparison with TSV in performance with much inexpensive cost. It is available for production. For instance, Solid-State Drive (SSD) in a package can be realized by stacking NAND Flash memories. A high-speed low-power DRAM interface can be implemented. Extension of communication distance to millimeter ranges makes it possible to probe internal bus data through package for debugging and to perform non-contact wafer simultaneous testing. Wireless power delivery by using inductive coupling will further widen the applications. In this paper technology and applications of the TCI are presented.