Recent progress in copper-based wafer bonding for 3-D ICs application

This article discusses thermo-compression bonding (also known as diffusion bonding) of metallic copper and its application in 3-D stacking of ICs. Bonding process is described and characterization results are presented. A survey on recent progress of copper-based wafer bonding, particularly low temperature process, and its application for on wafer 3-D ICs are presented.