Modeling and quantification of substrate noise induced by interconnects in SOCs

Interconnects carrying high-frequency signals are of the most important sources of substrate noise. This paper computes the amount of the interconnect-induced substrate noise. We develop a substrate extraction tool based on the Finite Difference Method and combine the extracted output model with accurate interconnect models. Through simulation of the complete substrate-interconnect model, we investigate the impacts of frequency and several interconnect geometrical parameters on the amount of the substrate noise.