Transition Structures for 3-D Integration of Substrate Integrated Waveguide Interconnects

Two transition structures, via and aperture transitions, used for 3-D integration of substrate integrated waveguide interconnects are investigated in this letter. Equivalent circuits for both structures are presented and evaluated through parametric studies and error analysis in comparison with fullwave simulations. The models are also validated by measurements of two test-boards containing the via and aperture transitions.