A Reliability Model for Low-Temperature Polycrystalline Silicon Thin-Film Transistors

We proposed here a reliability model that successfully introduces both the physical mechanisms of negative bias temperature instability (NBTI) and hot carrier stress (HCS) for p-channel low-temperature polycrystalline silicon thin-film transistors (LTPS TFTs). The proposed model is highly matched with the experimental results, in which the NBTI dominates the device reliability at small negative drain bias while the HCS dominates the degradation at large negative drain bias. In summary, the proposed model provides a comprehensive way to predict the lifetime of the p-channel LTPS TFTs, which is especially necessary for the system-on-panel circuitry design.