Computer vision for automatic inspection of a high density grid of pads on multi-chip modules (MCM-D)

Computer vision techniques have been developed and implemented for automatic optical inspection (AOI) of multichip modules with thin films. A case study, detailing the application of the techniques based on an Orbot TF501 visual inspection system platform for a high density grid of circular pads, is presented. The techniques presented here are capable of detecting electrical and non-electrical defects such as near shorts, wrong metallurgy, contamination, etc.<
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