A pilot line for multichip modules substrates

In 1990 Thomson Hybrides started design and installation of a pilot production line for high density thin film substrates. Copper/polyimide multilayer structures are processed on alumina substrates. Vacuum metallization, electroplating, and photolithography processes will be progressively transferred to new automatic equipment. Starting with standard square plates (4"*4"), the pilot line has been designed to be compatible with sizes up to 6"*6". The industrial approach is explained here. The pilot line is described in relation to the manufacturing cycle and process engineering. How the quality and yield should be affected by automatic processing is discussed.<
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