Equipment and process decisions for the manufacture of multi-chip modules (MCMs)

Summary form only given. The author discusses issues that face the engineering staff planning a manufacturing line for a processor module containing processor chips and cache memory, targeting an assembly line throughput of 3000 modules per month. Equipment and process requirements include treatment of fine-pitch, face-up solder tape automated bonding; wire bonding; die-attach dispense for heat transfer; passive device attach; rework and repair of device; post-solder non-CFC cleaning; cleaning room environment; handling of boards; burn-in; and electrical test.<
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