Microstrip discontinuities on cylindrical surfaces

S-parameter analysis of microstrip discontinuities on cylindrical dielectric surfaces using the full-wave frequency-domain TLM (transmission line matrix) method is presented. Microstep step and gap discontinuities on the same side of the substrate as well as overlay coupling of two microstrip lines on opposite sides of the substrate are investigated. The finite conductor thickness as well as the interaction of higher order modes between cascaded discontinuities is taken into account. The present algorithm is based on a 12-port symbolic S-matrix.<
>