Surface mounting of very fine pitch components: a new challenge

Based on their experience in developing and using 16- and 12.5-mil peripheral pitch custom compact single chip packages (CSCPs), the authors analyze the evolution and today's limits of package and board technologies and assembly techniques, with an emphasis on manufacturability. The manufacturing approach employed and the quality and reliability results obtained for 16- and 12.5-mil peripheral ceramic leaded packages are presented. A detailed analysis of packaging processes and limitations is performed for high-pin-count ceramic and plastic packages. Competitive packaging methods, namely PGA, LGA, and TAB, are compared, and future trends are analyzed.<
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