Packaging multichip modules (MCMs) into SEM-E configurations

The authors describe, in the context of a particular processor system development, a multichip module (MCM) technology aimed at meeting the challenges of application of advanced digital electronics systems in military platforms. In 1989, ERIM began a program to develop a multimodal advanced target recognition (ATR) processing engine. The ATR processor can be configured in any of several physical forms. One configuration is a standard electronics module (SEM-E) frame that fits a 3/4-width standard air transportable rack chassis. This configuration must have a backplane interconnect because of the chassis type. The work to date has developed the electrical, mechanical, and thermal packaging designs that are outlined.<
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