Polymer bonding of micro-machined silicon structures

Polymer bonding is an indirect bonding technique that can be performed at temperatures of less than 150 degrees C. Thin layers of negative photoresist polyimide and epoxy were used to bond micromachined test devices to other pieces of silicon. The strength of the resulting bond and the influence of primers like APS and HMDS on the bond strength were tested. The best results were achieved with negative photoresist without primer at a curing temperature of 130 degrees C. The bond strength was more than 130 kg/cm/sup 2/.<
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