High voltage, new driver IC technique based on silicon wafer direct-bonding (SDB)

Two fundamental techniques are presented for high-voltage driver ICs: dielectric isolation based on silicon wafer direct-bonding (DISDB) and a high-voltage junction termination technique (SIPOS resistive field plate). The SIPOS plate shields the external electric field influence on breakdown voltage. DISDB integrates low-voltage logic and high-voltage (500 V) devices and has three structural variations corresponding to different application fields.<
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