Substrate conduction mechanisms in convectively cooled simulated electronic packages

An analytical model is developed for the conduction from a heated surface element to a conductive substrate or board. The interaction from neighboring components on the board is modeled by modifying the upper board surface temperature. A linear superposition technique is used to demonstrate that the base solution for an isolated component may be used to predict board-level behavior by modification of the driving temperature difference for board conduction. By comparison of the model with data for an array of 1.27-cm cubical elements on a mildly conducting substrate, it is shown that the use of the measured element's adiabatic temperature as a descriptor of the board temperature allows successful correlation of both single element and surrounded element conduction heat transfer with two geometric parameters.<
>