Keynote Address: Developments in Cost Effective Packaging Technology for Microsystems Devices

The article consists of a Powerpoint presentation on packaging technology for microsystems devices. The areas discussed include: microsystems packaging; wafer level packaging; systems in a package; inertial sensors; side airbag sensor; fluidic sensors; microfluidic devices; fibre optic devices; subsystem integration; wafer bonding; flip chip assembly; angular rate sensor; and optical microsystems etc. etc.