Advanced multilayer thick-film technology for cost-effective millimetre-wave multi-chip modules

This paper describes the novel application of photoimageable thick film technology for the realization of multilayer millimeter-wave multi-chip modules at a low cost. The dielectric material has been characterized first time up to 110 GHz with a novel technique. TFMS and CPW transmission lines have been characterized with a loss of 0.2 dB/mm and 0.3 dB/mm respectively at 80 GHz. High Q multilayer lumped components have been designed and modeled up to 40 GHz with excellent performance. A 3 GHz lumped element filter has remarkably low pass band loss of 0.3 dB with high stop band attenuation (>40 dB), and yet is highly miniaturized. Multilayer passive components have been designed and characterised up to 65 GHz and the performances are comparable to many reported results for thin film processes and even micro machined transmission lines.