Supercomputers-interconnections and packaging

The packaging requirements imposed by 1-GHz clock rates and ways to meet them are considered. For supercomputers, many more input/output connections must be squeezed into less space and greater quantities of heat must be removed, also in less space. To cope with these problems, engineers are adding more interconnection layers, multichip modules, adopting exotic materials, such as diamond, and are exploring new technologies, such as high-temperature superconductivity. Each of these approaches is examined.<
>