3D placement algorithm with vertical via count constraints

Three-dimensional (3D) packaging via system-on-package is a potential alternative to meet the rigorous requirement of the interconnect delay problem. A 3D placement algorithm for two-stacked-die integration is proposed for wire length optimization. Cells are pre-partitioned into different dies to solve the conflict between wire length reduction and vertical via count constraint. A quadratic placement algorithm is adopted to place them on each die. Experimental results on a set of test cases from industry indicate the effectiveness and efficiency of our algorithm.