DREAM: a chip-package co-design tool for RF-mixed signal systems

'Package aware' IC design has not only become advantageous, but also essential towards optimum performance of high-end systems. Here, an early design tool has been presented that can assist a designer in chip-package co-design of RF and mixed signal systems. The primary function of this tool is to correlate metrics in the chip and package domain. The tool allows modifications of RF standard CMOS circuits based on package effects and in analyzing package power distribution. It evaluates the effect of package power supply noise on RF circuits in detail. The analysis can be used either to change the RF/mixed signal design or the packaging technology used for both simultaneously depending upon the application.