Production implementation of state-of-the-art electron beam inspection

Electron beam inspection (EBI), through the use of voltage contrast, is used extensively throughout the industry to identify in-line electrical failures. The inspection methodologies presented in this paper help us to understand and react to these buried yield detractors in a timely manner. The result is an increase in disposition efficiency and a decrease in mean time-to-detect. This paper will describe the implementation of a state-of-the-art EBI technology into 300 mm wafer manufacturing using the KLA-Tencor eS30 EBI tool. First, results will be shown to demonstrate sensitivity, throughput, and overall production worthiness. Next, we will describe the implementation of this technology into IBM's 300 mm production line. Finally, we will describe a case study that illustrates the value of this technique for monitoring electrical defectivity in volume production.