Design process supporting simulations on wafer level packages

The design process of innovative and advanced microelectronic systems requires the mechanical behaviour to be taken into account in order to achieve a high level of reliability from the very beginning of the electronic design. In this respect, all essential thermal and mechanical influences during manufacturing as well as operation need to be considered. The influence of design and process parameters on thermomechanical stresses is analysed numerically and pre-optimised for two different types of packages for wireless communication applications in the high frequency range. As a result, design and process improvements can be recommended for assembly levels 1 (wafer level) and 2 (interactions with the carrier and other components).