An automated solder application process for TAB and fine pitch surface mount assembly

Summary form only given. Technology has been developed that provides for high-yielding, low-variability solder application to fine pitch component card sites. The technology was developed specifically for the hot bar reflow outer lead bond attachment process associated with tape automated bonding (TAB): however, it can be extended to hot bar quad flat pack component attachment and to automated site redressing during repair operations. The solder application technology was developed from both the tooling and process standpoints. Key process variables were identified and optimized. The tool evolved from a lab-level feasibility model to a manufacturing prototype. The technology was integrated into the overall assembly flow.<
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