Chip Carrier Packaging Applications

The increasing number of pins required by large-scale integrated (LSI) devices has brought a corresponding increase in the size of dual in-line and flatpack packages using standard 0.1 in printed circuit board interconnects. The chip carrier approach, as originally applied on ceramic beards in place of hybrids and currently being introduced for epoxy/glass boards, offers significant packaging improvement. Characteristics, advantages, and comparisons are shown for both types.