3-D electromagnetic field analysis of interconnections in copper-polyimide multichip modules

A three-dimensional electromagnetic field analysis of interconnections in copper-polyimide multichip modules is described. This analysis is based on the spatial network method: a lattice network model of Maxwell's equation formulated in the time domain by Bergeron's method. Results of simulating reflection and transmission waves at interconnections are presented. Frequency characteristics of the scattering parameter S/sub 21/ are calculated using the fast Fourier transform (FFT). The 3-dB down cutoff frequencies of wire bonded, tape automated bonding (TAB), and flip-chip bonding (FCB) interconnections are, respectively, 6, 14, and 40 GHz; those of interconnection vias are over 200 GHz. Copper-polyimide multichip modules can, therefore, be applied to ultra-high-speed systems.<
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