Characterization of Aging Effects on Thermal and Mechanical Properties of Magnetically-Oriented ACA for Flexible and Stretchable Electronics

Next-generation electronics will rely heavily on easily customizable electronic devices and systems that can be quickly and affordably manufactured and integrated using various deposited materials on various multifunctional substrates. A novel magnetically aligned Anisotropic Conductive Epoxy is developed, which is the basis for realizing the manufacturing of such flexible and stretchable electronics with a rapid and reconfigurable surface mount technology (SMT) production technique. The magnetically-oriented anisotropic conductive adhesive (ACA) material and no-pressure processing technique will be utilized in this endeavor. The low-temperature cure of Magnetic ACA with its micron-size ferromagnetic particles is used to facilitate high-density interconnects that preserve the desired conformal and flexible characteristics. This paper will investigate the magnetic-oriented anisotropic conductive interconnect material in mechanical and thermal properties. A dynamic mechanical analyzer is used to characterize the viscoelastic behavior of the anisotropic conductive epoxy under three aging temperatures: 60C, 100C, and 125C from pristine conditions to 90 days. Thermal conductivity is obtained by the modified transient plane source (MTPS) method from pristine to 120 days.