Organically Packaged Components and Modules: Recent Advancements for Microwave and mm-Wave Applications

The wireless industry is moving at a faster pace than ever before. The number of mobile phone applications is growing rapidly; high-definition video, automotive radars, and high-resolution imaging markets are creating a demand for high-speed communication that goes well beyond what today's wireless systems can handle. Component integration, size miniaturization, cost reduction, reliability, and performance enhancement have become the primary focus of current wireless systems. To achieve these objectives, advanced packaging techniques have been developed that replace traditional bulky package configurations. These concepts include system-on-chip (SoC), system-in-package (SIP), and systemon-package (SoP) technologies, as illustrated in Figure 1.