A Method for Improving an Active Cooling Solution for LEDs

High power chip-on-board LEDs dissipate, when operating, a very high amount of heat (up to 80% of consumed energy can be converted into dissipated heat). For a very high power COB (chip-on-board) LED (light-emitting diode) light fitting, 90% of the amount of heat produced by the LED during operation is dissipated through the backplate, thus heat sinking solutions are actively researched. However the rest of 10% is not that well understood, due to various convection conditions. Since each Celsius degree is essential for the component's life span, additional ways of removing this heat need to be considered such as using active air jet cooling onto the LED lens.