Advanced TCAD Simulation of Silver Sintering for Power Modules Integration

The increasing dissipated amount of heat from the electronics is a result of the emerging miniaturization. [1] Therefore it is necessary to develop new interface materials with high thermal and electrical conductivity. Silver is one of the few materials that can meet these requirements. [2] The new Ag-sintering technology with low temperature and pressure enables to use silver as a bonding material instead of a solder or glue. Although silver has excellent electrical and thermal properties, aspects of electro-thermal reliability have to be analyzed before putting these new technologies into practice. This article explores the electro-thermal reliability of the Power converter for performance applications, using full 3D simulation. [3], [4]. The thermal design by means of thermal simulation becomes an integral part of the design process and is cheaper compared to experimentation. Thermal simulation was performed using the Synopsys.