Reliabilities and Failure Analysis of Printed Circuit Boards Interconnect Stress Test

Interconnect Stress Testing is currently being used more and more in PCB industries. It is an accelerated aging method providing vivid insight into plated through holes reliability of high performance boards. The test data analysis provides a detailed understanding of PTH life during assembly and/or rework. The testing mechanism of IST, test coupons and test methods are detailed in this paper, and analysis after IST failure is discussed.