Self-Assembly Technologies for FlexTrate™

We have developed new flexible hybrid electronics (FHE) systems called FlexTrate
^TM
that is high-performance and scalable flexible substrates embedding heterogeneous inorganic monocrystalline semiconductor dielets. In this work, a modified die-first FOWLP technology with surface tension-driven multichip self-assembly is used for the fabrication of FlexTrate
^TM
. The detailed self-assembly for the FlexTrate
^TM
application is described to precisely and highly integrate heterogeneous dielets embedded in PDMS as a flexible substrate in wafer-level processing.