Application of simulation and the Boehm spiral model to 300-mm logistics system risk reduction

Building on the lessons learned from the 150 mm to 200 mm transition in semiconductor manufacturing, much work has gone into the planning and development of 300-mm fabs. Examples of this include the work produced by SEMI, International SEMATECH's I300I and Japan's J300 programs. This work includes various standards and guidelines regarding the architecture and interfaces of loadports, equipment and software components. However, despite these efforts, there are a number of significant 300-mm risks that remain. Some of these risks involve specific fab operational methodologies, which may vary depending upon the type of fab involved. Additionally, there are many other risks associated with the development and implementation of a robust 300-mm logistics system. This paper defines some of the key risks associated with the development and implementation of a fully integrated 300-mm logistics system, and it shows how simulation can be used in conjunction with a risk management approach, i.e. the Boehm spiral model, to play a key role in the mitigation of those risks.