Test structures for MCM-D technology characterization

In our multichip module technology (MCM-D), a silicon chip is used as a substrate on which other commercial chips are flipped and soldered by a screen-printing method. This complex technology has specific test problems. In this paper, we present a set of classical and novel test structures addressed to the full characterization of an MCM/flip-chip/ball grid array/silicon substrate technology. We focus especially on the measurement of the chip-to-chip ball contact resistance, and on the electrical influence of nearby chips placed on top of circuits on the substrate.