Abstract:
This paper presents a de-embedding method based on pad and thru test structures for on-wafer inductor characterization. A transmission line model in combination with para...Show MoreMetadata
Abstract:
This paper presents a de-embedding method based on pad and thru test structures for on-wafer inductor characterization. A transmission line model in combination with parallel admittances describing the pads is used to characterize the thru test structure. This method is compared to the standard “open-short”, “open-thru” and “pad-open-short” de-embedding methods and electromagnetic simulations. It is demonstrated that the proposed method is more accurate or saves chip area compared to the standard de-embedding methods.
Date of Conference: 24-27 March 2014
Date Added to IEEE Xplore: 23 June 2014
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