Packaging education at the Dresden University of Technology/Germany

This paper firstly describes the principles of education at German Universities. After that, in more detail, the education profile at the Department of Electrical Engineering in Dresden University is explained. It offers main studies in five branches, one of them is Microelectronics. Students may, after having chosen one of the five main studies, finish their studies in several special areas of interest. The packaging education in the authors opinion needs to be a part of the main study in Microelectronics and especially part of the specialization in Semiconductor and Microsystems Technology. The paper discusses some of the contents of lectures, e.g. Packaging Technology, Microsystems Technology, Semiconductor Technology, Material Science, Physical Microanalysis and others. The great importance of practical experiments is one of the main experiences, and so we have more than 20 different technology oriented places for experimental purposes. Students with such an extensive knowledge in real packaging technology, are very well accepted in the industry. In general we notice that at many universities the packaging education is badly neglected in relation to the mostly preferred semiconductor technology. However, Dresden University of Technology is convinced of going in the right direction: packaging education corresponding to that which industry needs in all aspects of the product realization process.