Junction Capacitance Test-An INNOVATIVE Design of "Bond-off" Detection

In 2005 , PSG1 SOT54 Glue line generated 2 cases of justified "bond off" customer complaints from BT169 product. We have defined several improvement actions in our 8D reports, but was unable to come up with an effective real-time monitoring on "bond off" defect. In line with Philips Semiconductors' Zero Defect Quality Improvement Initiative, by working closely with our wire bonder manufacturer, ITEC, we acquired 12 sets of "bond-off" detector kits in mid-2005. However, they failed to effectively monitor this defect despite after 6 months of troubleshooting by ITEC experts.