An ovenless electromigration test system environment using test chips with on-chip heating and computer controlled testing

An electromigration test environment and test chip has been developed that permits standard ASTM electromigration testing to be conducted without the use of an oven or high-temperature rated test fixtures. More accurate temperature control is possible while simultaneously permitting multiple acceleration factors (temperature/current) to be running at the same time. On the research side, it is possible to reanalyze the resistance history data to select appropriate failure criteria and to optically monitor the electromigration tests in progress to observe formation of hillocks and voids as the test progresses. In a production application it permits higher test temperatures to reduce testing time without the associated high cost of high-temperature test fixtures.<
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