Abstract:
Cracks or fractures were found at the heel of bond wire after decapsulation and subsequent ultrasonic cleaning. No such cracking was found prior to cleaning. The effect o...Show MoreMetadata
Abstract:
Cracks or fractures were found at the heel of bond wire after decapsulation and subsequent ultrasonic cleaning. No such cracking was found prior to cleaning. The effect of ultrasonic cleaning on the bond wire was simulated and analysed using finite element analysis (FEA). The results show that the heel crack is likely induced by resonant vibration of the bond wire.
Published in: Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005.
Date of Conference: 27 June 2005 - 01 July 2005
Date Added to IEEE Xplore: 25 July 2005
Print ISBN:0-7803-9301-5
Contents 