Design and characterization of a post-processed copper heat sink for smart power drivers [lateral nDMOS drivers]

Heat sinks of various geometries have been post-processed by copper electroplating on top of large area power drivers to improve thermal management. The efficiency of the heat sink was quantified by energy capability (EC) measurements. Thermal as well as electro-thermal simulations backed up experimental results. A 25 /spl mu/m thick copper layer improved EC by approx. 25%, translating into a driver area reduction by the same amount for EC critical applications.