A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure for evaluation of interface uniformity of the Ti-Al alloy/p-type 4H-SiC contact | IEEE Conference Publication | IEEE Xplore

A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure for evaluation of interface uniformity of the Ti-Al alloy/p-type 4H-SiC contact


Abstract:

A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure is proposed to characterize the Ti-Al alloy/p-type 4H-SiC contact. It is confirmed that the tes...Show More

Abstract:

A multi-contact six-terminal cross-bridge Kelvin resistor (CBKR) structure is proposed to characterize the Ti-Al alloy/p-type 4H-SiC contact. It is confirmed that the test structure can judge the uniformity of the contact interface without destructive analysis such as cross-sectional transmission electron microscopy. Comparing with the results of singlecontact CBKR structure, it is observed that the contact interface is non-uniform and the formation of low resistivity interface depends on the contact area. This area-dependence issue should be solved in order to improve the SiC power devices and CMOS ICs.
Date of Conference: 27-30 March 2023
Date Added to IEEE Xplore: 10 April 2023
ISBN Information:

ISSN Information:

Conference Location: Tokyo, Japan

Funding Agency:


Contact IEEE to Subscribe

References

References is not available for this document.