Abstract:
This paper presents a new generation of 600 V 15 A CIPOS(TM) (control integrated power system) Tiny IM323 IPM (intelligent power module) product in a DIL (dual in-line) p...Show MoreMetadata
Abstract:
This paper presents a new generation of 600 V 15 A CIPOS(TM) (control integrated power system) Tiny IM323 IPM (intelligent power module) product in a DIL (dual in-line) package with transfer molded type. It combines the features of Infineon TRENCHSTOP(TM) RC-D2 (reverse conducting for drives) IGBTs and optimized SOI (silicon on insulator) gate driver to achieve an excellent solution for up to 1.5 kW motor drive applications. Especially, this module offers the smallest package size with high power density. This paper provides an overall description of the new 600 V 15 A CIPOS(TM) Tiny IM323 product along with its electrical characteristics, thermal performance, adopted revers conducting IGBTs, and SOI gate driver.
Date of Conference: 26-27 October 2022
Date Added to IEEE Xplore: 16 March 2023
Print ISBN:978-3-8007-5911-8
Conference Location: Shanghai, China