The design of a voltage conversion SIP based on electrothermal coupling method

With the continuous improvement of demand and indicators, miniaturization, high performance, and high reliability are the development trends of remote sensing cameras. So the SIP technology has been instead of the traditional PCB design method in the design of remote sensing cameras more and more. In this paper, 10-channel voltage conversion SIP module has been designed, which supply power for the focal plane of the remote sensing camera detector, and the ALN integrated forming package has been choose to SIP module. In the SIP design process, the electro-thermal coupling simulation analysis method is used to predict and analyze the design temperature, optimize the layout and power/ground network design, and analyze the impact of the package on the module temperature. At last, the temperature comparison has been made between the simulated and measured. Through three times electro-thermal coupling iteration, the maximum simulated temperature of the SIP substrate was 47. 6°C, and the maximum temperature of the substrate was 46.3°C which measured by the infrared thermal imager. The relative error is 2.8%, which satisfies the design requirement. The electrothermal coupling method can ensure the performance analysis of SIP, which no longer isolated the temperature and electrical characteristics, the result of which are more accurate and effective to guide the SIP design, and guarantees the performance of SIP products.