Study on a kind of thermal source chip for the performance analysis of micro channel heat sink: Simulation and experimental validation

Micro channel cooling technology is one kind of forced heat exchange cooling technology, and has good potential applications in high power electronic devices and microsystem integration field. However, the performance analysis is a technical issue for the application of micro channel heat sink. A thermal source chip for analyzing the performance of micro channel heat sink accurately and conveniently is presented in this paper. In order to analyze the performance of thermal source chip, the thermodynamics simulation is carried out by using finite element software. Then, the thermal source chip is fabricated, and the thermal measuring experiment is performed to verify the simulation results. The simulation results indicate that the surface temperature of thermal source chip increases with the applied voltage, and the maximum heat flux of thermal source chip appeared at the 80 V applied voltage. The experiment results show good agreement with the simulation.