Study on Thermal cycle and Insulation Characteristics of High Reliable IGBT Module

With the increasing complexity of the new generation of high-quality weapon system, more and more IGBT modules are used under the condition of high voltage and large current, and the reliability of IGBT directly affects the stability of equipment system. IGBT module is composed of a variety of packaging materials, the packaging material, packaging process and packaging structure of IGBT are the key factors that affect its service life and reliability. Thermal cycle test and dielectric voltage resistance test were carried out to compare the reliability difference of the four IGBT modules which encapsulated different ceramic substrates. The results show that the thermal cycle life and insulation performance of Si3N4 ceramic substrate are better than those of other ceramic substrates withstand voltage test and appearance are passing after 500 thermal cycle. The geometry parameter and materials of DBC ceramic substrate are the key parameters which affect the reliability. Si3N4 ceramic substrate has the best performance, and Si3N4 is best used as substrate material for high reliability IGBT modules.