Inductance characterization and improvement on a small GQFN package

Integrated circuit (IC) packages nowadays are becoming more robust and getting smaller. Product manufacturers are moving towards to a smaller body size as it can be easily fit into their specifications but a package that has a smaller body size has its own restriction. In this paper, a small package size should meet a nominal inductance value as one of the package requirements. To be able to meet the requirement, a series of Design of Experiment (DOE) will be done from the wire diameter to be used to the wire placement on the leadframe. As part of the device characterization, a wire sweep will also be assessed through simulation to check whether the package will encounter a wire sway since the package contains long wires that can also affect the inductance values.