Structural, electrical properties and degradation processes in the Cu- and Ni-enriched thick-film elements for sensor electronics

Structural and electrical properties as well as peculiarities of degradation processes in the Cu- and Ni-enriched thick-film elements based on oxymanganospinel ceramics are investigated. The thermal “shock” effect in the initial stage of isothermal exposure at 170
^o
C with future stabilization of electrical resistance on this level up to final degradation test was revealed. It is shown that high temperature-sensitivity and stabilization of electrical parameters in the studied single-phase thick-film elements can be used for preparation of sensor components based on thick films for micro- and nanoelectronics.